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Lee, Y. H.; Song, M. H.; Ju, B. K.; Shin, D. K.; Oh, M. H. |
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Publication  |
Thin film phosphor prepared by physical vapor deposition for field emission display application |
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Journal Article |
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1997 |
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Abstract |
Journal of Vacuum Science & Technology A |
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J. Vac. Sci. Technol. A |
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B15 |
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Summary Language |
512-515 |
Series Editor |
Field Emission |
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2483 |
| Permanent link to this record |
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Uh, H. S.; Kwon, S. J.; Lee, J. D. |
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Process design and emission properties of gated n+ polycrystalline silicon field emitter arrays for flat-panel display applications |
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Journal Article |
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1997 |
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Journal of Vacuum Science & Technology A |
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J. Vac. Sci. Technol. A |
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B15 |
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472-476 |
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Field Emission |
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2491 |
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Lee, C. G.; Park, B. G.; Lee, J. D. |
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Fabrication and characterization of volcano-shaped field emitters surrounded by planar gates |
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Journal Article |
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1997 |
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Journal of Vacuum Science & Technology A |
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J. Vac. Sci. Technol. A |
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B15 |
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464-467 |
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Field Emission |
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2879 |
| Permanent link to this record |
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Lee, B.; Elliott, T. S.; Mazumdar, T. K.; McIntyre, P. M.; Pang, Y.; Trost, H. - J. |
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Knife-edge thin film field emission cathodes on (110) silicon wafers |
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Journal Article |
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1994 |
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Journal of Vacuum Science & Technology A |
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J. Vac. Sci. Technol. A |
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B12 |
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644-647 |
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Field Emission |
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3238 |
| Permanent link to this record |
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Kratschmer, E.; Kim, H. S.; Thomason, R., M G; Lee, K. Y.; Rishton, S. A.; Yu, M. L.; Chang, P., T H |
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Sub-40 nm resolution 1 keV scanning tunneling microscope field-emission microcolumn |
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Journal Article |
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1994 |
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Journal of Vacuum Science & Technology A |
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J. Vac. Sci. Technol. A |
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B12 |
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3503-3507 |
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Scanning Tunnelling Microscopy |
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3354 |
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Lee, S.; Matsunaga, H.; Sauvage, X.; Horita, Z. |
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Strengthening of Cu–Ni–Si alloy using high-pressure torsion and aging |
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Journal Article |
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2014 |
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Materials Characterization |
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90 |
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62-70 |
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High-pressure torsion; Ultrafine grain; Cu–Ni–Si; Electrical conductivity; Apt |
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Abstract An age-hardenable Cu–2.9%Ni–0.6%Si alloy was subjected to high-pressure torsion. Aging behavior was investigated in terms of hardness, electrical conductivity and microstructural features. Transmission electron microscopy showed that the grain size is refined to ~ 150 nm and the Vickers microhardness was significantly increased through the HPT processing. Aging treatment of the HPT-processed alloy led to a further increase in the hardness. Electrical conductivity is also improved with the aging treatment. It was confirmed that the simultaneous strengthening by grain refinement and fine precipitation is achieved while maintaining high electrical conductivity. Three dimensional atom probe analysis including high-resolution transmission electron microscopy revealed that nanosized precipitates having compositions of a metastable Cu3Ni5Si2 phase and a stable NiSi phase were formed in the Cu matrix by aging of the HPT-processed samples and these particles are responsible for the additional increase in strength after the HPT processing. |
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1044-5803 |
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NU @ karnesky @ |
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11492 |
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Lee, W.-S.; Chen, T.-H. |
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Mechanical and microstructural response of aluminum-scandium (Al-Sc) alloy as a function of strain rate and temperature |
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Journal Article |
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2009 |
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Materials Chemistry and Physics |
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113 |
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2-3 |
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734-745 |
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Al-Sc alloy; Strain rate sensitivity; Activation energy; Shearing; Dislocation; Precipitates |
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This study applies a compressive split Hopkinson bar to investigate the mechanical response, microstructural evolution and fracture characteristics of aluminum-scandium (Al-Sc) alloy at temperatures ranging from -100 °C to 300 °C and strain rates of 1.2 × 103 s-1, 3.2 × 103 s-1 and 5.8 × 103 s-1. The relationship between the dynamic mechanical behaviour of the Al-Sc alloy and its microstructural characteristics is explored. The fracture features and microstructural evolution are observed using scanning and transmission electron microscopy techniques. The stress-strain relationships indicate that the flow stress, work hardening rate and strain rate sensitivity increase with strain rate, but decrease with increasing temperature. Conversely, the activation volume and activation energy increase as the temperature increases or the strain rate decreases. Additionally, the fracture strain reduces with increasing strain rate and decreasing temperature. However, at room temperature under a low strain rate of 1.2 × 103 s-1 and at a high experimental temperature of 300 °C under all three tested strain rates, the specimens do not fracture, even under large strain deformations. The Zerilli-Armstrong fcc constitutive model is used to describe the plastic deformation behaviour of the Al-Sc alloy. Comparing the predicted flow stress values with the experimental values over all the considered strain rate and temperature conditions, the maximum error between the two sets of results is found to be less than 4%. SEM observations show that the specimens fracture predominantly as a result of a shearing mechanism. Moreover, the surfaces of the fractured specimens are characterised by transgranular dimpled features, which are indicative of a ductile fracture mode. Fine Al3Sc precipitates are found to be distributed in the matrix and at the grain boundaries. Finally, the TEM analysis results reveal that the dislocation density increases, but the dislocation cell size decreases, with increasing strain rate. However, a higher temperature causes the dislocation density to decrease, thereby increasing the dislocation cell size. |
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NU @ karnesky @ |
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10512 |
| Permanent link to this record |
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Park, Kyung-Tae; Hwang, Duck-Young; Lee, Young-Kook; Kim, Young-Kuk; Shin, Dong Hyuk |
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High strain rate superplasticity of submicrometer grained 5083 Al alloy containing scandium fabricated by severe plastic deformation |
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Journal Article |
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2003 |
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Materials Science and Engineering A |
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Mater. Sci. Eng. A |
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341 |
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1-2 |
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273-281 |
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High strain rate superplasticity; 5083 Al alloy; Scandium; Severe plastic deformation; Ultrafine grains |
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High strain rate superplasticity (HSRS) was obtained in a commercial 5083 Al alloy by introducing a ultrafine grained structure of 0.3 small mu, Greekm through severe plastic deformation and by adding a dilute amount of scandium (Sc) as a microstructure stabilizer. Tensile tests were carried out on the as-processed sample at temperatures of 623–823 K and initial strain rates of 1×10−3–1×100 s−1. The maximum elongation to failure of 740% was obtained at 773 K and 1×10−2 s−1. HSRS of the alloy was attributed to the combined effects of dynamic recrystallization and preservation of fine recrystallized grains by the presence of Sc. The mechanical behavior of the alloy at 773 K was characterized by a sigmoidal behavior in a plot of stress vs strain rate in the double logarithmic scale. The origin of the sigmoidal behavior was discussed in terms of microstructural evolution during superplastic deformation. An examination of the fractured samples revealed that failure occurred in a brittle manner related to cavitation rather than necking. Cavity stringers were formed parallel to the tensile axis by interlinkage of jagged-shaped isolated cavities along grain boundaries aligned to the tensile axis. |
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NU @ karnesky @ |
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585 |
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Han, S. Z.; Park, S. I.; Huh, J. S.; Lee, Z. H.; Lee, H. M. |
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Lattice Matching of D0$_{23}$ and D0$_{22}$ Phases in Al-6at.%(Ti,V,Zr) Systems |
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Journal Article |
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1997 |
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Materials Science and Engineering A |
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Mater. Sci. Eng. A |
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230 |
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1-2 |
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100-106 |
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refbase @ user |
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1170 |
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Lee, H. M. |
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Design of Al$_3$(Ti,V,Zr) Systems through Phase-Stability Calculations |
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Journal Article |
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1992 |
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Materials Science and Engineering A |
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Mater. Sci. Eng. A |
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152 |
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1-2 |
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26-30 |
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refbase @ user |
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1325 |
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