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Type Marquis, Emmanuelle A.; Seidman, David N.; Dunand, David C.
  Publication Effect of Mg Addition on the Creep and Yield Behavior of an Al–Sc Alloy Volume Journal Article
Pages 2003
  Abstract Acta Materialia  
  Corporate Author Acta Mater.  
Publisher 51  
Editor 16
  Summary Language 4751-4760 Series Editor Transmission electron microscopy; Aluminum alloys; Coarsening; Creep; Al3Sc precipitates; olid-solution alloys dislocation climb viscous glide deformation stress dependence particles fracture; Al-Sc  
Abbreviated Series Title The relationships between microstructure and strength were studied at room temperature and 300 °C in an Al–2 wt% Mg–0.2 wt% Sc alloy, containing Mg in solid-solution and Al3Sc (L12 structure) as nanosize precipitates. At room temperature, the yield strength is controlled by the superposition of solid-solution and precipitation strengthening. At 300 °C and at large applied stresses, the creep strength, which is characterized by a stress exponent of ~5, is significantly improved compared to binary Al–Sc alloys, and is independent of the size of the Al3Sc precipitates. At small applied stress, a threshold stress exists, increasing from 9% to 70% of the Orowan stress with increasing Al3Sc precipitate radius from 2 to 25 nm. An existing model based on a climb-controlled bypass mechanism is in semi-quantitative agreement with the precipitate radius dependence of the threshold stress. The model is, however, only valid for coherent precipitates, and the Al3Sc precipitates lose coherency for radii larger than 11 nm. For semi-coherent precipitates with radii greater than 15 nm, the threshold stress remains high, most likely because of the presence of interfacial misfit dislocations.
  Series Issue Marquis, E. A. Sandia Natl Labs, Thin Film & Interface Dept, Livermore, CA 94550 USA Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA ISSN  
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no NU @ karnesky @ 212
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